Part Details for CY7C15632KV18-500BZXI by Infineon Technologies AG
Overview of CY7C15632KV18-500BZXI by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C15632KV18-500BZXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
CY7C15632KV18-500BZXI-ND
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DigiKey | IC SRAM 72MBIT PAR 165FBGA Min Qty: 272 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
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$251.5518 | Buy Now |
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DISTI #
CY7C15632KV18-500B
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C15632KV18-500B) RoHS: Compliant Min Qty: 4 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 898 Partner Stock |
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$203.4964 / $246.1650 | Buy Now |
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DISTI #
CY7C15632KV18-500B
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C15632KV18-500B) RoHS: Compliant Min Qty: 272 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$302.8390 | Buy Now |
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DISTI #
727-CY7C15632KV18BZX
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Mouser Electronics | SRAM 72MB (4Mx18) 1.8v 500MHz QDR II SRAM RoHS: Compliant | 0 |
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$244.2300 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 272 Package Multiple: 272 Container: Tray | 0Tray |
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$244.2300 | Buy Now |
Part Details for CY7C15632KV18-500BZXI
CY7C15632KV18-500BZXI CAD Models
CY7C15632KV18-500BZXI Part Data Attributes:
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CY7C15632KV18-500BZXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C15632KV18-500BZXI
Infineon Technologies AG
QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 500 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.36 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.85 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 13 mm |