Part Details for DM77S185AJ by National Semiconductor Corporation
Overview of DM77S185AJ by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DM77S185AJ
DM77S185AJ CAD Models
DM77S185AJ Part Data Attributes
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DM77S185AJ
National Semiconductor Corporation
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Datasheet
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DM77S185AJ
National Semiconductor Corporation
IC 2K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | DIP, DIP18,.3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 60 ns | |
| JESD-30 Code | R-GDIP-T18 | |
| JESD-609 Code | e0 | |
| Memory Density | 8192 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX4 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for DM77S185AJ
This table gives cross-reference parts and alternative options found for DM77S185AJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM77S185AJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27LS185PCB | OTP ROM, 2KX4, 60ns, Bipolar, PDIP18, PLASTIC, DIP-18 | AMD | DM77S185AJ vs AM27LS185PCB |
| AM27PS185DC | OTP ROM, 2KX4, 60ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | DM77S185AJ vs AM27PS185DC |
| DM77S185AJ | 2KX4 OTPROM, 60ns, CDIP18, CERAMIC, DIP-18 | Texas Instruments | DM77S185AJ vs DM77S185AJ |
| DM77S184AJ | IC 2K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM | Texas Instruments | DM77S185AJ vs DM77S184AJ |
| AM27LS185DC | OTP ROM, 2KX4, 60ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | DM77S185AJ vs AM27LS185DC |
| DM77S184AJ | IC 2K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM | National Semiconductor Corporation | DM77S185AJ vs DM77S184AJ |