Part Details for EM6GC16EWXC-12H by Etron Technology Inc
Overview of EM6GC16EWXC-12H by Etron Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for EM6GC16EWXC-12H
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 131 |
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$6.4750 / $10.5000 | Buy Now | |
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NAC | 1 Gb 64M X 16 DDR3 SDRAM 96 FBGA Comm Temp RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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$1.7600 / $2.0500 | Buy Now |
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DISTI #
EM6GC16EWXC-12H
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Avnet Asia | DRAM Chip DDR3 SDRAM 1G-Bit 64Mx16 1.5V 96-Pin F-BGA (Alt: EM6GC16EWXC-12H) RoHS: Compliant Min Qty: 1900 Package Multiple: 1900 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ |
Part Details for EM6GC16EWXC-12H
EM6GC16EWXC-12H CAD Models
EM6GC16EWXC-12H Part Data Attributes
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EM6GC16EWXC-12H
Etron Technology Inc
Buy Now
Datasheet
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Compare Parts:
EM6GC16EWXC-12H
Etron Technology Inc
DDR DRAM, 64MX16, CMOS, PBGA96, FBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | ETRON TECHNOLOGY INC | |
| Package Description | TFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |