Part Details for FM27C256V55 by Fairchild Semiconductor Corporation
Overview of FM27C256V55 by Fairchild Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for FM27C256V55
FM27C256V55 CAD Models
FM27C256V55 Part Data Attributes
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FM27C256V55
Fairchild Semiconductor Corporation
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Datasheet
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FM27C256V55
Fairchild Semiconductor Corporation
OTP ROM, 32KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
Part Package Code | QFJ | |
Package Description | QCCJ, LDCC32,.5X.6 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PQCC-J32 | |
JESD-609 Code | e0 | |
Length | 13.995 mm | |
Memory Density | 262144 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC32,.5X.6 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.75 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.56 mm | |
Standby Current-Max | 0.0002 A | |
Supply Current-Max | 0.05 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.455 mm |
Alternate Parts for FM27C256V55
This table gives cross-reference parts and alternative options found for FM27C256V55. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FM27C256V55, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
IS27HC256-55PL | OTP ROM, 32KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | Integrated Silicon Solution Inc | FM27C256V55 vs IS27HC256-55PL |
CY27C256-55JC | OTP ROM, 32KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | FM27C256V55 vs CY27C256-55JC |
CY7C274-55JC | OTP ROM, 32KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | FM27C256V55 vs CY7C274-55JC |
27HC256-55/L | 32K X 8 OTPROM, 55 ns, PQCC32, PLASTIC, LCC-32 | Microchip Technology Inc | FM27C256V55 vs 27HC256-55/L |
MX27C256QC-55 | OTP ROM, 32KX8, 55ns, CMOS, PQCC32, PLASTIC, MS-016, LCC-32 | Macronix International Co Ltd | FM27C256V55 vs MX27C256QC-55 |
AM27H256-55JC | OTP ROM, 32KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | AMD | FM27C256V55 vs AM27H256-55JC |
CY7C256-55JC | OTP ROM, 32KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | FM27C256V55 vs CY7C256-55JC |