Part Details for FWPXA270C0E416 by Marvell Technology Group Ltd
Overview of FWPXA270C0E416 by Marvell Technology Group Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Space Technology
Aerospace and Defense
Transportation and Logistics
Communication and Networking
Automotive
Part Details for FWPXA270C0E416
FWPXA270C0E416 CAD Models
FWPXA270C0E416 Part Data Attributes
|
|
FWPXA270C0E416
Marvell Technology Group Ltd
Buy Now
Datasheet
|
Compare Parts:
FWPXA270C0E416
Marvell Technology Group Ltd
Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MARVELL SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360 | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 26 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 13.002 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B360 | |
| JESD-609 Code | e0 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.59 mm | |
| Speed | 416 MHz | |
| Supply Voltage-Max | 1.705 V | |
| Supply Voltage-Min | 1.2825 V | |
| Supply Voltage-Nom | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for FWPXA270C0E416
This table gives cross-reference parts and alternative options found for FWPXA270C0E416. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FWPXA270C0E416, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MC7448VS800ND | 32-BIT, 800MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 | Freescale Semiconductor | FWPXA270C0E416 vs MC7448VS800ND |
| MPC8541ECVTAQDX | 32-BIT, 1600MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | FWPXA270C0E416 vs MPC8541ECVTAQDX |
| TSXPC750AVGU/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | FWPXA270C0E416 vs TSXPC750AVGU/T10LE |
| TSXPC750AVGS8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | FWPXA270C0E416 vs TSXPC750AVGS8LE |
| PC755MZF366LE | RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | FWPXA270C0E416 vs PC755MZF366LE |
| TSXPC750AMGSU/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | FWPXA270C0E416 vs TSXPC750AMGSU/T10LH |
| PC7448FGH1267ND | RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | Teledyne e2v | FWPXA270C0E416 vs PC7448FGH1267ND |
| MPC755BZT300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, PLASTIC, BGA-360 | Motorola Semiconductor Products | FWPXA270C0E416 vs MPC755BZT300LD |
| TSPC750AMGU12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | FWPXA270C0E416 vs TSPC750AMGU12LE |
| MC7447AVU1000NB | A7PM PB FREE | Freescale Semiconductor | FWPXA270C0E416 vs MC7447AVU1000NB |