Part Details for GS8162Z72CC-250I by GSI Technology
Overview of GS8162Z72CC-250I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for GS8162Z72CC-250I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8162Z72CC-250I
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Avnet Americas | SRAM Chip Sync Octal 2.5V/3.3V 18M-Bit 256K x 72-Bit 5.5ns/3ns 209-Pin FBGA Tray - Trays (Alt: GS8162Z72CC-250I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$65.2848 / $80.3880 | Buy Now |
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DISTI #
464-GS8162Z72CC-250I
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Mouser Electronics | SRAM 2.5 or 3.3V 256K x 72 18M | 0 |
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$67.4500 / $74.7500 | Order Now |
Part Details for GS8162Z72CC-250I
GS8162Z72CC-250I CAD Models
GS8162Z72CC-250I Part Data Attributes
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GS8162Z72CC-250I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8162Z72CC-250I
GSI Technology
ZBT SRAM, 256KX72, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 209 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | |
| JESD-30 Code | R-PBGA-B209 | |
| Length | 22 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 72 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 209 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX72 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for GS8162Z72CC-250I
This table gives cross-reference parts and alternative options found for GS8162Z72CC-250I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8162Z72CC-250I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8162Z72CC-250IT | ZBT SRAM, 256KX72, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8162Z72CC-250I vs GS8162Z72CC-250IT |
| GS8162Z72CGC-250I | ZBT SRAM, 256KX72, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209 | GSI Technology | GS8162Z72CC-250I vs GS8162Z72CGC-250I |
| GS8162Z72CC-250T | ZBT SRAM, 256KX72, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8162Z72CC-250I vs GS8162Z72CC-250T |
| GS8162Z72CGC-250IT | ZBT SRAM, 256KX72, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209 | GSI Technology | GS8162Z72CC-250I vs GS8162Z72CGC-250IT |