Datasheets
GS8662T36BGD-350I by: GSI Technology

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8662T36BGD-350I by GSI Technology

Overview of GS8662T36BGD-350I by GSI Technology

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Price & Stock for GS8662T36BGD-350I

Part # Distributor Description Stock Price Buy
DISTI # 2364-GS8662T36BGD-350I-ND
DigiKey IC SRAM 72MBIT PARALLEL 165FPBGA Min Qty: 15 Lead time: 26 Weeks Container: Tray Temporarily Out of Stock
  • 15 $138.1093
$138.1093 Buy Now
DISTI # GS8662T36BGD-350I
Avnet Americas SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662T36BGD-350I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $147.1140
  • 288 $144.4392
  • 576 $137.3064
  • 864 $133.7400
  • 1,152 $129.2820
  • 1,440 $123.0408
  • 14,400 $119.4744
$119.4744 / $147.1140 Buy Now
DISTI # 464-GS8662T36BGD350I
Mouser Electronics SRAM 1.8 or 1.5V 2M x 36 72M RoHS: Compliant 0
  • 15 $134.0800
  • 30 $133.8700
  • 60 $131.8800
$131.8800 / $134.0800 Order Now

Part Details for GS8662T36BGD-350I

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GS8662T36BGD-350I Part Data Attributes:

GS8662T36BGD-350I GSI Technology
Buy Now Datasheet
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GS8662T36BGD-350I GSI Technology DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE
Clock Frequency-Max (fCLK) 350 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
Length 15 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 0.765 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm

Alternate Parts for GS8662T36BGD-350I

This table gives cross-reference parts and alternative options found for GS8662T36BGD-350I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662T36BGD-350I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662T36BD-350I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8662T36BGD-350I vs GS8662T36BD-350I
GS8662T36BGD-350IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662T36BGD-350IT
Part Number Description Manufacturer Compare
GS8662QT37BD-357T QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662QT37BD-357T
CY7C1514V18-200BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662T36BGD-350I vs CY7C1514V18-200BZXI
GS8662QT37BD-300I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662QT37BD-300I
GS8662TT37BGD-350IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662TT37BGD-350IT
GS8662QT37BGD-200I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662QT37BGD-200I
GS8662T36BD-350T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8662T36BGD-350I vs GS8662T36BD-350T
GS8662TT37BGD-450IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662TT37BGD-450IT
GS8662R36BD-400I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8662T36BGD-350I vs GS8662R36BD-400I
GS8662TT38BD-450 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662TT38BD-450
GS8662TT37BGD-300T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T36BGD-350I vs GS8662TT37BGD-300T

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