Part Details for HYG0UEG0BF1-6SH0E by SK Hynix Inc
Overview of HYG0UEG0BF1-6SH0E by SK Hynix Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for HYG0UEG0BF1-6SH0E
HYG0UEG0BF1-6SH0E CAD Models
HYG0UEG0BF1-6SH0E Part Data Attributes
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HYG0UEG0BF1-6SH0E
SK Hynix Inc
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Datasheet
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HYG0UEG0BF1-6SH0E
SK Hynix Inc
Memory Circuit, 32MX16, CMOS, PBGA149, FBGA-149
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SK HYNIX INC | |
| Package Description | FBGA-149 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | IT ALSO CONTAINS 512M(64M X 8BIT) NAND FLASH MEMORY OPERATES AT 2.7V NOM SUPPLY | |
| JESD-30 Code | R-PBGA-B149 | |
| Length | 14 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 149 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |