Datasheets
IDT70T3539MS166BCG by: Integrated Device Technology Inc

Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, BGA-256

Part Details for IDT70T3539MS166BCG by Integrated Device Technology Inc

Overview of IDT70T3539MS166BCG by Integrated Device Technology Inc

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Applications Industrial Automation Computing and Data Storage Electronic Manufacturing

Part Details for IDT70T3539MS166BCG

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IDT70T3539MS166BCG Part Data Attributes

IDT70T3539MS166BCG Integrated Device Technology Inc
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IDT70T3539MS166BCG Integrated Device Technology Inc Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, BGA-256
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description LBGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 12 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Length 17 mm
Memory Density 18874368 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 256
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.9 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

Alternate Parts for IDT70T3539MS166BCG

This table gives cross-reference parts and alternative options found for IDT70T3539MS166BCG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT70T3539MS166BCG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
70T3539MS166BC8 512K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation IDT70T3539MS166BCG vs 70T3539MS166BC8
70T3539MS166BCG8 Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, BGA-256 Integrated Device Technology Inc IDT70T3539MS166BCG vs 70T3539MS166BCG8
70T3539MS166BCG 512K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation IDT70T3539MS166BCG vs 70T3539MS166BCG
IDT70T3539MS166BC8 Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, BGA-256 Integrated Device Technology Inc IDT70T3539MS166BCG vs IDT70T3539MS166BC8
IDT70T3539MS166BC Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, BGA-256 Integrated Device Technology Inc IDT70T3539MS166BCG vs IDT70T3539MS166BC
70T3539MS166BC8 CABGA-256, Reel Integrated Device Technology Inc IDT70T3539MS166BCG vs 70T3539MS166BC8
70T3539MS166BCG CABGA-256, Tray Integrated Device Technology Inc IDT70T3539MS166BCG vs 70T3539MS166BCG
70T3539MS166BC CABGA-256, Tray Integrated Device Technology Inc IDT70T3539MS166BCG vs 70T3539MS166BC
Part Number Description Manufacturer Compare
70V7589S133BCI CABGA-256, Tray Integrated Device Technology Inc IDT70T3539MS166BCG vs 70V7589S133BCI
70V7589S133BCI8 CABGA-256, Reel Integrated Device Technology Inc IDT70T3539MS166BCG vs 70V7589S133BCI8
IDT70V7589S133BCG8 Dual-Port SRAM, 64KX36, 15ns, PBGA256, BGA-256 Integrated Device Technology Inc IDT70T3539MS166BCG vs IDT70V7589S133BCG8
CYD18S36V18-200BBXI Dual-Port SRAM, 512KX36, 9ns, CMOS, PBGA256, 19 X 19 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 Cypress Semiconductor IDT70T3539MS166BCG vs CYD18S36V18-200BBXI
IDT70T653MS12BCI8 Dual-Port SRAM, 512KX36, 12ns, CMOS, PBGA256, BGA-256 Integrated Device Technology Inc IDT70T3539MS166BCG vs IDT70T653MS12BCI8
70T653MS12BC 512K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation IDT70T3539MS166BCG vs 70T653MS12BC
CYDD18S18V18-167BBXI Dual-Port SRAM, 512KX36, 9ns, CMOS, PBGA256, 19 X 19 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 Cypress Semiconductor IDT70T3539MS166BCG vs CYDD18S18V18-167BBXI
CYD02S36V18-167BBXI Dual-Port SRAM, 64KX36, 4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Cypress Semiconductor IDT70T3539MS166BCG vs CYD02S36V18-167BBXI
70T3589S200BCG Dual-Port SRAM, 64KX36, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc IDT70T3539MS166BCG vs 70T3589S200BCG
CYDD18S18V18-167BBC Dual-Port SRAM, 512KX36, 9ns, CMOS, PBGA256, 19 X 19 MM, 1.70 MM HEIGHT, 1 MM PITCH, FBGA-256 Cypress Semiconductor IDT70T3539MS166BCG vs CYDD18S18V18-167BBC

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