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Overview of K7J643682M-EI300 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for K7J643682M-EI300 by Samsung Semiconductor
Part Data Attributes for K7J643682M-EI300 by Samsung Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code
|
BGA
|
Package Description
|
LBGA, BGA165,11X15,40
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK)
|
300 MHz
|
I/O Type
|
SEPARATE
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e1
|
Length
|
17 mm
|
Memory Density
|
75497472 bit
|
Memory IC Type
|
DDR SRAM
|
Memory Width
|
36
|
Moisture Sensitivity Level
|
2
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
2MX36
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA165,11X15,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Standby Voltage-Min
|
1.7 V
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
15 mm
|
Alternate Parts for K7J643682M-EI300
This table gives cross-reference parts and alternative options found for K7J643682M-EI300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7J643682M-EI300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C1524JV18-300BZI | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | K7J643682M-EI300 vs CY7C1524JV18-300BZI |
K7J643682M-FI30T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | K7J643682M-EI300 vs K7J643682M-FI30T |
K7J643682M-EI30 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | K7J643682M-EI300 vs K7J643682M-EI30 |
K7J643682M-EI30T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | K7J643682M-EI300 vs K7J643682M-EI30T |
CY7C1524JV18-300BZXI | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7J643682M-EI300 vs CY7C1524JV18-300BZXI |
CY7C1524AV18-300BZI | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | K7J643682M-EI300 vs CY7C1524AV18-300BZI |
K7J643682M-FI30 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | K7J643682M-EI300 vs K7J643682M-FI30 |
CY7C1524AV18-300BZXI | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7J643682M-EI300 vs CY7C1524AV18-300BZXI |
K7J643682M-FI300 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | K7J643682M-EI300 vs K7J643682M-FI300 |
CY7C1524V18-300BZXI | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7J643682M-EI300 vs CY7C1524V18-300BZXI |