Part Details for M38510/23114BWC by SRI International Sarnoff
Overview of M38510/23114BWC by SRI International Sarnoff
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for M38510/23114BWC
M38510/23114BWC CAD Models
M38510/23114BWC Part Data Attributes
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M38510/23114BWC
SRI International Sarnoff
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M38510/23114BWC
SRI International Sarnoff
Standard SRAM, 256X4, 45ns, TTL, 0.375 X 0.875 INCH, DIP-22
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SRI INTERNATIONAL | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP22,.4 | |
| Pin Count | 22 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 45 ns | |
| JESD-30 Code | R-XDIP-T22 | |
| Memory Density | 1024 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 22 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256X4 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP22,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Qualified | |
| Screening Level | MIL-M-38510 Class B | |
| Supply Current-Max | 0.17 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | TTL | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for M38510/23114BWC
This table gives cross-reference parts and alternative options found for M38510/23114BWC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/23114BWC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M38510/23114BWB | Standard SRAM, 256X4, 45ns, TTL, 0.375 X 0.875 INCH, DIP-22 | SRI International Sarnoff | M38510/23114BWC vs M38510/23114BWB |
| AM93L422APC | Standard SRAM, 256X4, 45ns, TTL, PDIP22, PLASTIC, DIP-22 | AMD | M38510/23114BWC vs AM93L422APC |
| MCM93422PC | Standard SRAM, 256X4, 45ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 | Motorola Semiconductor Products | M38510/23114BWC vs MCM93422PC |
| 93422PC | Cache SRAM, 256X4, 45ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 | Fairchild Semiconductor Corporation | M38510/23114BWC vs 93422PC |
| M38510/23114BWA | 256X4 STANDARD SRAM, 45ns, DIP22, 0.375 X 0.875 INCH, DIP-22 | Texas Instruments | M38510/23114BWC vs M38510/23114BWA |
| AM91L22-45DCB | Standard SRAM, 256X4, 45ns, NMOS, CDIP22, CERAMIC, DIP-22 | AMD | M38510/23114BWC vs AM91L22-45DCB |
| AM91L22-45PCB | Standard SRAM, 256X4, 45ns, NMOS, PDIP22, PLASTIC, DIP-22 | AMD | M38510/23114BWC vs AM91L22-45PCB |
| AM93L422ADCB | Standard SRAM, 256X4, 45ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 | AMD | M38510/23114BWC vs AM93L422ADCB |
| 93422DCQR | Cache SRAM, 256X4, 45ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 | Fairchild Semiconductor Corporation | M38510/23114BWC vs 93422DCQR |
| AM93422PCB | Standard SRAM, 256X4, 45ns, TTL, PDIP22, PLASTIC, DIP-22 | AMD | M38510/23114BWC vs AM93422PCB |