Part Details for MAX3108AEWA+T by Maxim Integrated Products
Overview of MAX3108AEWA+T by Maxim Integrated Products
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Part Details for MAX3108AEWA+T
MAX3108AEWA+T CAD Models
MAX3108AEWA+T Part Data Attributes
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MAX3108AEWA+T
Maxim Integrated Products
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MAX3108AEWA+T
Maxim Integrated Products
Serial I/O Controller, 1 Channel(s), 3MBps, BICMOS, PBGA25, WLP-25
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
| Package Description | VFBGA, BGA25,5X5,16 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Address Bus Width | ||
| Boundary Scan | NO | |
| Bus Compatibility | I2C; IRDA; MICROWIRE; RS232; RS485; SPI | |
| Clock Frequency-Max | 35 MHz | |
| Communication Protocol | MIL STD 1553A; MIL STD 1553B | |
| Data Transfer Rate-Max | 3 MBps | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B25 | |
| JESD-609 Code | e2 | |
| Length | 2.065 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 25 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA25,5X5,16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.69 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 2.8 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER NICKEL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 2.065 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |