Part Details for MEC1632X-AUE by Microchip Technology Inc
Overview of MEC1632X-AUE by Microchip Technology Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for MEC1632X-AUE
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
579-MEC1632X-AUE
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Mouser Electronics | 32-bit Microcontrollers - MCU RoHS: Compliant | 0 |
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Order Now | |
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DISTI #
MEC1632X-AUE
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Microchip Technology Inc | Low Power Mobile Embedded Flash ARC EC BC-LinkTM with CEC, Projected EOL: 2039-10-19 RoHS: Compliant pbFree: Yes |
126 Alternates Available |
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$6.8400 / $9.4600 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 880 Factory Stock |
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$0 | Buy Now |
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Bristol Electronics | 176 |
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RFQ | ||
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Ameya Holding Limited | 126 |
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RFQ |
Part Details for MEC1632X-AUE
MEC1632X-AUE CAD Models
MEC1632X-AUE Part Data Attributes
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MEC1632X-AUE
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
MEC1632X-AUE
Microchip Technology Inc
Low Power Mobile Embedded Flash ARC EC BC-LinkTM with CEC
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | LFBGA-169 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Microchip | |
| Address Bus Width | ||
| Boundary Scan | YES | |
| Bus Compatibility | I2C; PCI; SPI; UART | |
| Clock Frequency-Max | 20.78 MHz | |
| Communication Protocol | ASYNC, BIT | |
| JESD-30 Code | S-PBGA-B169 | |
| JESD-609 Code | e1 | |
| Length | 11 mm | |
| Low Power Mode | YES | |
| Number of DMA Channels | 10 | |
| Number of I/O Lines | 142 | |
| Number of Serial I/Os | 142 | |
| Number of Terminals | 169 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA169, 13X13, 32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | TS 16949 | |
| Seated Height-Max | 1.4 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max | 3.63 V | |
| Supply Voltage-Min | 2.97 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 11 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |