Part Details for MT25QL512ABA8E12-0SIT by Micron Technology Inc
Overview of MT25QL512ABA8E12-0SIT by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MT25QL512ABA8E12-0SIT
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
MT25QL512ABA8E12-0
|
Avnet Americas | NOR Flash Serial-SPI 3V 512Mbit 512M/256M/128M x 1bit/2bit/4bit 6ns 24-Pin TBGA - Trays (Alt: MT25QL512ABA8E12-0) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Container: Tray | 0 |
|
RFQ | |
DISTI #
MT25QL512ABA8E12-0
|
Avnet Americas | NOR Flash Serial-SPI 3V 512Mbit 512M/256M/128M x 1bit/2bit/4bit 6ns 24-Pin TBGA - Trays (Alt: MT25QL512ABA8E12-0) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Container: Tray | 0 |
|
RFQ |
Part Details for MT25QL512ABA8E12-0SIT
MT25QL512ABA8E12-0SIT CAD Models
MT25QL512ABA8E12-0SIT Part Data Attributes:
|
MT25QL512ABA8E12-0SIT
Micron Technology Inc
Buy Now
Datasheet
|
Compare Parts:
MT25QL512ABA8E12-0SIT
Micron Technology Inc
Flash, 512MX1, PBGA24, 6 X 8 MM, ROHS COMPLIANT, PLASTIC, TBGA-24
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | TBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
Length | 8 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA24,5X5,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 3 V | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | QSPI | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Protection | HARDWARE/SOFTWARE |