Part Details for S25FL129P0XBHI310 by Spansion
Overview of S25FL129P0XBHI310 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Computing and Data Storage
Energy and Power Systems
Part Details for S25FL129P0XBHI310
S25FL129P0XBHI310 CAD Models
S25FL129P0XBHI310 Part Data Attributes:
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S25FL129P0XBHI310
Spansion
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Datasheet
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S25FL129P0XBHI310
Spansion
Flash, 16MX8, PBGA24, 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,4X6,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.038 mA | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for S25FL129P0XBHI310
This table gives cross-reference parts and alternative options found for S25FL129P0XBHI310. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S25FL129P0XBHI310, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S25FL129P0XBHV313 | Flash, 16MX8, PBGA24, 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | Spansion | S25FL129P0XBHI310 vs S25FL129P0XBHV313 |
| S25FL129P0XBHI313 | Flash, 16MX8, PBGA24, 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | Cypress Semiconductor | S25FL129P0XBHI310 vs S25FL129P0XBHI313 |
| S25FL129P0XBHV310 | Flash, 16MX8, PBGA24, 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | Spansion | S25FL129P0XBHI310 vs S25FL129P0XBHV310 |
| S25FL129P0XBHI310 | Flash, 16MX8, PBGA24, 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | Cypress Semiconductor | S25FL129P0XBHI310 vs S25FL129P0XBHI310 |
| S25FL129P0XBHV313 | Flash, 128MX1, PBGA24, 8 X 6 MM, 1 MM PITCH, LOW HALOGEN AND LEAD FREE, BGA-24 | Cypress Semiconductor | S25FL129P0XBHI310 vs S25FL129P0XBHV313 |
| S25FL129P0XBHI313 | Flash, 16MX8, PBGA24, 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | Spansion | S25FL129P0XBHI310 vs S25FL129P0XBHI313 |