Part Details for S25FS512SAGBHI213 by Spansion
Overview of S25FS512SAGBHI213 by Spansion
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Part Details for S25FS512SAGBHI213
S25FS512SAGBHI213 CAD Models
S25FS512SAGBHI213 Part Data Attributes
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S25FS512SAGBHI213
Spansion
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Datasheet
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S25FS512SAGBHI213
Spansion
Flash, 128MX4, PBGA24, FBGA-24
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SPANSION INC | |
| Package Description | FBGA-24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 1.8 V | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |