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2GB SLC NAND 24NM BGA 6.5X8 (EEPROM)
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TC58NVG1S3HBAI6
Toshiba America Electronic Components
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Datasheet
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TC58NVG1S3HBAI6
Toshiba America Electronic Components
2GB SLC NAND 24NM BGA 6.5X8 (EEPROM)
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | BGA | |
Package Description | VFBGA, | |
Pin Count | 67 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Toshiba | |
JESD-30 Code | R-PBGA-B67 | |
Length | 8 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 67 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 3.3 V | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Type | SLC NAND TYPE | |
Width | 6.5 mm |