Part Details for TC58NYG2S0FBAI4 by Toshiba America Electronic Components
Overview of TC58NYG2S0FBAI4 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for TC58NYG2S0FBAI4
TC58NYG2S0FBAI4 CAD Models
TC58NYG2S0FBAI4 Part Data Attributes
|
TC58NYG2S0FBAI4
Toshiba America Electronic Components
Buy Now
Datasheet
|
Compare Parts:
TC58NYG2S0FBAI4
Toshiba America Electronic Components
TC58NYG2S0FBAI4
|
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | BGA | |
Package Description | VFBGA, BGA63,10X12,32 | |
Pin Count | 63 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 25 ns | |
Command User Interface | YES | |
Data Polling | YES | |
JESD-30 Code | R-PBGA-B63 | |
Length | 11 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Sectors/Size | 2K | |
Number of Terminals | 63 | |
Number of Words | 536870912 words | |
Number of Words Code | 512000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA63,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Page Size | 4K words | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 1.8 V | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Seated Height-Max | 1 mm | |
Sector Size | 256K | |
Standby Current-Max | 0.00005 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Toggle Bit | YES | |
Width | 9 mm |