Part Details for TSPC750AMGU8LE by Thales Group
Overview of TSPC750AMGU8LE by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC750AMGU8LE
TSPC750AMGU8LE CAD Models
TSPC750AMGU8LE Part Data Attributes
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TSPC750AMGU8LE
Thales Group
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Datasheet
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TSPC750AMGU8LE
Thales Group
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC750AMGU8LE
This table gives cross-reference parts and alternative options found for TSPC750AMGU8LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AMGU8LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC750AMGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGU8LE vs TSPC750AMGU/T8LH |
| TSPC750AMGU8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AMGU8LE vs TSPC750AMGU8LE |
| TSXPC750AVGU/T8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AMGU8LE vs TSXPC750AVGU/T8LH |
| MPC750ARX200LX | 32-BIT, 200MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | TSPC750AMGU8LE vs MPC750ARX200LX |
| TSPC750AVGB/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGU8LE vs TSPC750AVGB/T8LE |
| TSXPC750AVGU8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AMGU8LE vs TSXPC750AVGU8LE |
| TSPC750AMGB/Q8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGU8LE vs TSPC750AMGB/Q8LH |
| MPC750ARX200TX | 32-BIT, 200MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | TSPC750AMGU8LE vs MPC750ARX200TX |
| TSPC750AMGU8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGU8LE vs TSPC750AMGU8LH |
| TSPC750AVG8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSPC750AMGU8LE vs TSPC750AVG8LE |