Part Details for W25Q128BVEJP by Winbond Electronics Corp
Overview of W25Q128BVEJP by Winbond Electronics Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for W25Q128BVEJP
W25Q128BVEJP CAD Models
W25Q128BVEJP Part Data Attributes:
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W25Q128BVEJP
Winbond Electronics Corp
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Datasheet
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W25Q128BVEJP
Winbond Electronics Corp
Flash, 16MX8, PDSO8, WSON-8
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Additional Feature | ORGANIZED AS 65,536 PAGES OF 256 BYTES; MORE THAN 20 YEAR DATA RETENTION | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Data Retention Time-Min | 20 | |
| JESD-30 Code | R-PDSO-N8 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 0.8 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Cycle Time-Max (tWC) | 15 ms |
Alternate Parts for W25Q128BVEJP
This table gives cross-reference parts and alternative options found for W25Q128BVEJP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q128BVEJP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W25Q128FVEIP | Flash, 128MX1, PDSO8, 8 X 6 MM, GREEN, WSON-8 | Winbond Electronics Corp | W25Q128BVEJP vs W25Q128FVEIP |
| W25Q128BVEAP | Flash, 128MX1, PDSO8, 8 X 6 MM, GREEN, WSON-8 | Winbond Electronics Corp | W25Q128BVEJP vs W25Q128BVEAP |
| W25Q128BVEBP | Flash, 16MX8, PDSO8, WSON-8 | Winbond Electronics Corp | W25Q128BVEJP vs W25Q128BVEBP |