Part Details for W25X20LZPI by Winbond Electronics Corp
Overview of W25X20LZPI by Winbond Electronics Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for W25X20LZPI
W25X20LZPI CAD Models
W25X20LZPI Part Data Attributes
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W25X20LZPI
Winbond Electronics Corp
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Datasheet
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W25X20LZPI
Winbond Electronics Corp
Flash, 2MX1, 6 X 5 MM, WSON-8
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | SON | |
| Package Description | HVSON, SOLCC8,.25 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | SYNCHRONOUS MODE ALSO POSSIBLE | |
| Clock Frequency-Max (fCLK) | 33 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-XDSO-N8 | |
| JESD-609 Code | e0 | |
| Length | 6 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.8 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Type | NOR TYPE | |
| Width | 5 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for W25X20LZPI
This table gives cross-reference parts and alternative options found for W25X20LZPI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25X20LZPI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W25X20LZPCZ | Flash, 2MX1, 6 X 5 MM, ROHS COMPLIANT, WSON-8 | Winbond Electronics Corp | W25X20LZPI vs W25X20LZPCZ |
| W25X20LZPCG | Flash, 2MX1, 6 X 5 MM, GREEN, WSON-8 | Winbond Electronics Corp | W25X20LZPI vs W25X20LZPCG |
| W25X20LZPIZ | Flash, 2MX1, 6 X 5 MM, ROHS COMPLIANT, WSON-8 | Winbond Electronics Corp | W25X20LZPI vs W25X20LZPIZ |