Datasheets
X28C010DMB-12 by:

128KX8 EEPROM 5V, 120ns, CDIP32, CERAMIC, DIP-32

Part Details for X28C010DMB-12 by Intersil Corporation

Overview of X28C010DMB-12 by Intersil Corporation

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

Price & Stock for X28C010DMB-12

Part # Distributor Description Stock Price Buy
Chip1Cloud   7000
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Part Details for X28C010DMB-12

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X28C010DMB-12 Part Data Attributes

X28C010DMB-12 Intersil Corporation
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X28C010DMB-12 Intersil Corporation 128KX8 EEPROM 5V, 120ns, CDIP32, CERAMIC, DIP-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTERSIL CORP
Part Package Code DIP
Package Description DIP-32
Pin Count 32
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 120 ns
Additional Feature PAGE WRITE
Command User Interface NO
Data Polling YES
JESD-30 Code R-GDIP-T32
JESD-609 Code e0
Memory Density 1048576 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Page Size 256 words
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.92 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit YES
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for X28C010DMB-12

This table gives cross-reference parts and alternative options found for X28C010DMB-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C010DMB-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
28C010TRT2DI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010DMB-12 vs 28C010TRT2DI-12
28C010TRPDI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010DMB-12 vs 28C010TRPDI-12
AS28C010CW-12/883C EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components X28C010DMB-12 vs AS28C010CW-12/883C
28C010TRTDI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010DMB-12 vs 28C010TRTDI-12
28C010TRT4DB-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010DMB-12 vs 28C010TRT4DB-12
FT28C010-12D-X EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Force Technologies Ltd X28C010DMB-12 vs FT28C010-12D-X
28C010TRT4DE-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010DMB-12 vs 28C010TRT4DE-12
FT28C010-12CMB-X EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd X28C010DMB-12 vs FT28C010-12CMB-X
5962-3826707MXA EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components X28C010DMB-12 vs 5962-3826707MXA
5962-3826707MXA EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 Atmel Corporation X28C010DMB-12 vs 5962-3826707MXA
Part Number Description Manufacturer Compare
5962-3826707MXA EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components X28C010DMB-12 vs 5962-3826707MXA
AT28C010E-12TI EEPROM, 128KX8, 120ns, Parallel, CMOS, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 Atmel Corporation X28C010DMB-12 vs AT28C010E-12TI
AT28C010-12DK-MQ EEPROM, 128KX8, 120ns, Parallel, CMOS, CDFP32, 0.435 INCH, BOTTOM BRAZED, CERAMIC, MO-115, DFP-32 Atmel Corporation X28C010DMB-12 vs AT28C010-12DK-MQ
AT28C010-12PU EEPROM, 128KX8, 120ns, Parallel, CMOS, PDIP32, 0.600 INCH, GREEN, PLASTIC, DIP-32 Atmel Corporation X28C010DMB-12 vs AT28C010-12PU
5962-3826719QMX EEPROM, 128KX8, 120ns, Parallel, CMOS, CDFP32, CERAMIC, DFP-32 Maxwell Technologies X28C010DMB-12 vs 5962-3826719QMX
AT28C010-12JI EEPROM, 128KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 Atmel Corporation X28C010DMB-12 vs AT28C010-12JI
AT28C010-12JC EEPROM, 128KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 Atmel Corporation X28C010DMB-12 vs AT28C010-12JC
5962-9679606HYA EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 White Microelectronics X28C010DMB-12 vs 5962-9679606HYA
X28C010FM-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32 Xicor Inc X28C010DMB-12 vs X28C010FM-12
AT28C010E-12JC EEPROM, 128KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 Atmel Corporation X28C010DMB-12 vs AT28C010E-12JC

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