Part Details for X28C010DMB-12C7309 by Intersil Corporation
Overview of X28C010DMB-12C7309 by Intersil Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
Part Details for X28C010DMB-12C7309
X28C010DMB-12C7309 CAD Models
X28C010DMB-12C7309 Part Data Attributes
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X28C010DMB-12C7309
Intersil Corporation
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Datasheet
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X28C010DMB-12C7309
Intersil Corporation
128KX8 EEPROM 5V, 120ns, CDIP32, CERAMIC, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTERSIL CORP | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 120 ns | |
| Command User Interface | NO | |
| Data Polling | YES | |
| JESD-30 Code | R-GDIP-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Page Size | 256 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 5.92 mm | |
| Standby Current-Max | 0.0005 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | YES | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for X28C010DMB-12C7309
This table gives cross-reference parts and alternative options found for X28C010DMB-12C7309. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C010DMB-12C7309, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 28C010TRT2DI-12 | EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 | Data Device Corporation | X28C010DMB-12C7309 vs 28C010TRT2DI-12 |
| 28C010TRPDI-12 | EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 | Data Device Corporation | X28C010DMB-12C7309 vs 28C010TRPDI-12 |
| AS28C010CW-12/883C | EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Micross Components | X28C010DMB-12C7309 vs AS28C010CW-12/883C |
| 28C010TRTDI-12 | EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 | Data Device Corporation | X28C010DMB-12C7309 vs 28C010TRTDI-12 |
| 28C010TRT4DB-12 | EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 | Data Device Corporation | X28C010DMB-12C7309 vs 28C010TRT4DB-12 |
| FT28C010-12D-X | EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Force Technologies Ltd | X28C010DMB-12C7309 vs FT28C010-12D-X |
| 28C010TRT4DE-12 | EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 | Data Device Corporation | X28C010DMB-12C7309 vs 28C010TRT4DE-12 |
| FT28C010-12CMB-X | EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | X28C010DMB-12C7309 vs FT28C010-12CMB-X |
| 5962-3826707MXA | EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Micross Components | X28C010DMB-12C7309 vs 5962-3826707MXA |
| 5962-3826707MXA | EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Atmel Corporation | X28C010DMB-12C7309 vs 5962-3826707MXA |