Part Details for AM1810EZWTA3 by Texas Instruments
Overview of AM1810EZWTA3 by Texas Instruments
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for AM1810EZWTA3
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
AM1810EZWTA3-ND
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DigiKey | IC MPU SITARA 375MHZ 361NFBGA Min Qty: 90 Lead time: 6 Weeks Container: Tray | Temporarily Out of Stock |
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$25.0391 | Buy Now |
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DISTI #
595-AM1810EZWTA3
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Mouser Electronics | Microprocessors - MPU Sitara Processor RoHS: Compliant | 0 |
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$23.9900 / $24.5400 | Order Now |
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Ameya Holding Limited | IC MPU SITARA 375MHZ 361NFBGA | 905 |
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RFQ | |
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Chip1Cloud | IC MPU SITARA 375MHZ 361NFBGA / MPU AM18x RISC 32bit 375MHz 1.8V/3.3V 361-Pin NFBGA Tray | 1530 |
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RFQ |
Part Details for AM1810EZWTA3
AM1810EZWTA3 CAD Models
AM1810EZWTA3 Part Data Attributes:
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AM1810EZWTA3
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
AM1810EZWTA3
Texas Instruments
Sitara processor: Arm9, LPDDR, DDR2, display, Ethernet, PROFIBUS 361-NFBGA -40 to 105
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | LFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 14 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B361 | |
| JESD-609 Code | e1 | |
| Length | 16 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 64 | |
| Number of Terminals | 361 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 131072 | |
| Seated Height-Max | 1.4 mm | |
| Speed | 375 MHz | |
| Supply Current-Max | 0.31 mA | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 16 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |