Part Details for AM2431BSDFHIALXR by Texas Instruments
Overview of AM2431BSDFHIALXR by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Transportation and Logistics
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Automotive
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Aerospace and Defense
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for AM2431BSDFHIALXR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-AM2431BSDFHIALXRCT-ND
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DigiKey | IC MCU 32BIT 128KB TCM 293VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
1000 In Stock |
|
$10.0264 / $15.8300 | Buy Now |
DISTI #
595-AM2431BSDFHIALXR
|
Mouser Electronics | ARM Microcontrollers - MCU Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz 293-FCCSP -40 to 125 RoHS: Compliant | 0 |
|
$10.0200 | Order Now |
|
Ameya Holding Limited | 1027 |
|
RFQ |
Part Details for AM2431BSDFHIALXR
AM2431BSDFHIALXR CAD Models
AM2431BSDFHIALXR Part Data Attributes:
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AM2431BSDFHIALXR
Texas Instruments
Buy Now
Datasheet
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AM2431BSDFHIALXR
Texas Instruments
Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz 293-FCCSP -40 to 125
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | FCCSP-293 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Clock Frequency-Max | 800 MHz | |
JESD-30 Code | S-PBGA-B293 | |
Length | 11 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 293 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA293,21X21,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max | 0.895 V | |
Supply Voltage-Min | 0.81 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Width | 11 mm | |
uPs/uCs/Peripheral ICs Type | SoC |