Datasheets
AM2431BSDFHIALXR by: Texas Instruments

Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz 293-FCCSP -40 to 125

Part Details for AM2431BSDFHIALXR by Texas Instruments

Overview of AM2431BSDFHIALXR by Texas Instruments

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Applications Space Technology Environmental Monitoring Internet of Things (IoT) Smart Cities Transportation and Logistics Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Medical Imaging Automotive Consumer Electronics Security and Surveillance Audio and Video Systems Aerospace and Defense Healthcare Renewable Energy Robotics and Drones

Price & Stock for AM2431BSDFHIALXR

Part # Distributor Description Stock Price Buy
DISTI # 296-AM2431BSDFHIALXRCT-ND
DigiKey IC MCU 32BIT 128KB TCM 293VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 1000
In Stock
  • 1 $15.8300
  • 10 $14.5500
  • 25 $13.9464
  • 100 $12.2880
  • 250 $11.6849
  • 500 $10.9310
  • 1,000 $10.0264
$10.0264 / $15.8300 Buy Now
DISTI # 595-AM2431BSDFHIALXR
Mouser Electronics ARM Microcontrollers - MCU Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz 293-FCCSP -40 to 125 RoHS: Compliant 0
  • 1,000 $10.0200
$10.0200 Order Now
Ameya Holding Limited   1027
RFQ

Part Details for AM2431BSDFHIALXR

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AM2431BSDFHIALXR Part Data Attributes:

AM2431BSDFHIALXR Texas Instruments
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AM2431BSDFHIALXR Texas Instruments Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz 293-FCCSP -40 to 125
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Package Description FCCSP-293
Reach Compliance Code not_compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Clock Frequency-Max 800 MHz
JESD-30 Code S-PBGA-B293
Length 11 mm
Moisture Sensitivity Level 3
Number of Terminals 293
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA293,21X21,20
Package Shape SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 250
Seated Height-Max 1 mm
Supply Voltage-Max 0.895 V
Supply Voltage-Min 0.81 V
Supply Voltage-Nom 0.85 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Width 11 mm
uPs/uCs/Peripheral ICs Type SoC

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