Datasheets
AM27256-1DC by:

UVPROM, 32KX8, 170ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Part Details for AM27256-1DC by AMD

Overview of AM27256-1DC by AMD

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for AM27256-1DC

Part # Distributor Description Stock Price Buy
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 13
Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 8
  • 1 $13.1398
  • 3 $12.2638
  • 7 $11.6798
$11.6798 / $13.1398 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 8
  • 1 $15.7678
  • 3 $14.7166
  • 6 $14.0158
$14.0158 / $15.7678 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 19
  • 1 $15.7678
  • 6 $14.0158
  • 19 $12.9646
$12.9646 / $15.7678 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 10
  • 1 $15.7678
  • 3 $14.7166
  • 6 $14.0158
$14.0158 / $15.7678 Buy Now

Part Details for AM27256-1DC

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AM27256-1DC Part Data Attributes:

AM27256-1DC AMD
Buy Now Datasheet
Compare Parts:
AM27256-1DC AMD UVPROM, 32KX8, 170ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description WDIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 170 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.1475 mm
Memory Density 262144 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM27256-1DC

This table gives cross-reference parts and alternative options found for AM27256-1DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27256-1DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C256-175DI UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DI
AT27C256R-17DI UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation AM27256-1DC vs AT27C256R-17DI
NMC27C256Q17 IC 32K X 8 UVPROM, 170 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM Texas Instruments AM27256-1DC vs NMC27C256Q17
NMC27C256Q17 IC 32K X 8 UVPROM, 170 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27256-1DC vs NMC27C256Q17
AM27C256-175DIB UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DIB
AS27C256-17JXT UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components AM27256-1DC vs AS27C256-17JXT
TMS27C256-1JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments AM27256-1DC vs TMS27C256-1JE
AM27C256-175DC UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DC
AM27C256-170DIB UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-170DIB
AM27C256-175DCB UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DCB
Part Number Description Manufacturer Compare
TMS27C256-1JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments AM27256-1DC vs TMS27C256-1JE
AM27C256-175DC UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DC
SMJ27C256-17JM UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Micross Components AM27256-1DC vs SMJ27C256-17JM
AS27C256-17JXT UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components AM27256-1DC vs AS27C256-17JXT
NMC27C256Q17 IC 32K X 8 UVPROM, 170 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27256-1DC vs NMC27C256Q17
AM27C256-170DIB UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-170DIB
AT27C256R-17DI UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation AM27256-1DC vs AT27C256R-17DI
AM27C256-175DI UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DI
AM27C256-175DCB UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DCB
AM27C256-175DIB UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27256-1DC vs AM27C256-175DIB

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