Part Details for AM27S35ADMB by AMD
Overview of AM27S35ADMB by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for AM27S35ADMB
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | PROM, 1K x 8, 24 Pin, Ceramic, DIP | 4 |
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$56.8440 / $59.8358 | Buy Now |
Part Details for AM27S35ADMB
AM27S35ADMB CAD Models
AM27S35ADMB Part Data Attributes
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AM27S35ADMB
AMD
Buy Now
Datasheet
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Compare Parts:
AM27S35ADMB
AMD
OTP ROM, 1KX8, TTL, CDIP24,
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | DIP, DIP24,.3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 35 ns | |
JESD-30 Code | R-XDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 2048 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 1024 words | |
Number of Words Code | 512 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 512X4 | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 Class B (Modified) | |
Supply Current-Max | 0.185 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | TTL | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |