Part Details for APQ-8016E-1-760NSP-TR-01-0 by Qualcomm
Overview of APQ-8016E-1-760NSP-TR-01-0 by Qualcomm
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Applications
Consumer Electronics
Price & Stock for APQ-8016E-1-760NSP-TR-01-0
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 553 |
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RFQ | ||
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Bristol Electronics | 22804 |
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DISTI #
SMC-APQ-8016E-1-760NSP-TR-01-0
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days Date Code: 23 | 2000 |
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RFQ |
Part Details for APQ-8016E-1-760NSP-TR-01-0
APQ-8016E-1-760NSP-TR-01-0 CAD Models
APQ-8016E-1-760NSP-TR-01-0 Part Data Attributes
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APQ-8016E-1-760NSP-TR-01-0
Qualcomm
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Datasheet
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APQ-8016E-1-760NSP-TR-01-0
Qualcomm
RISC Microprocessor, CMOS, PBGA760, 14 X 12 MM, 0.96 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, NSP-760
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | QUALCOMM INC | |
| Package Description | 14 X 12 MM, 0.96 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, NSP-760 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Qualcomm | |
| JESD-30 Code | R-PBGA-B760 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 760 | |
| Operating Temperature-Max | 60 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 255 | |
| Seated Height-Max | 0.96 mm | |
| Supply Voltage-Max | 1.12 V | |
| Supply Voltage-Min | 0.84 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |