Part Details for BAP50LX,315 by NXP Semiconductors
Overview of BAP50LX,315 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for BAP50LX,315
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
568-14518-1-ND
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DigiKey | RF DIODE PIN 50V 150MW SOD2 Min Qty: 1 Lead time: 52 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
7725 In Stock |
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$0.0640 / $0.3800 | Buy Now |
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Rochester Electronics | Pin Diode, 50V RoHS: Compliant Status: Obsolete Min Qty: 1 | 8558 |
|
$0.0485 / $0.0570 | Buy Now |
Part Details for BAP50LX,315
BAP50LX,315 CAD Models
BAP50LX,315 Part Data Attributes
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BAP50LX,315
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
BAP50LX,315
NXP Semiconductors
BAP50LX - Silicon PIN diode DFN 2-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | DFN | |
Package Description | 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SOT882T, 2 PIN | |
Pin Count | 2 | |
Manufacturer Package Code | SOD882D | |
Reach Compliance Code | compliant | |
HTS Code | 8541.10.00.70 | |
Samacsys Manufacturer | NXP | |
Breakdown Voltage-Min | 50 V | |
Configuration | SINGLE | |
Diode Capacitance-Max | 0.55 pF | |
Diode Capacitance-Nom | 0.4 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 5 Ω | |
Diode Res Test Current | 0.5 mA | |
Diode Res Test Frequency | 100 MHz | |
Diode Type | PIN DIODE | |
Frequency Band | S BAND | |
JESD-30 Code | R-PBCC-N2 | |
JESD-609 Code | e3 | |
Minority Carrier Lifetime-Nom | 1 µs | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Peak Reflow Temperature (Cel) | 260 | |
Power Dissipation-Max | 0.15 W | |
Qualification Status | Not Qualified | |
Reverse Test Voltage | ||
Surface Mount | YES | |
Technology | POSITIVE-INTRINSIC-NEGATIVE | |
Terminal Finish | Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 |
Alternate Parts for BAP50LX,315
This table gives cross-reference parts and alternative options found for BAP50LX,315. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BAP50LX,315, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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BAP50LX | DIODE SILICON, PIN DIODE, 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SOT882T, 2 PIN, PIN Diode | NXP Semiconductors | BAP50LX,315 vs BAP50LX |