Datasheets
BGM123N256V2 by: Silicon Laboratories Inc

Telecom Circuit, 1-Func, BGM-123, 56 PIN

Part Details for BGM123N256V2 by Silicon Laboratories Inc

Overview of BGM123N256V2 by Silicon Laboratories Inc

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Applications Consumer Electronics Security and Surveillance Internet of Things (IoT) Financial Technology (Fintech) Smart Cities Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Telecommunications Entertainment and Gaming Communication and Networking

Price & Stock for BGM123N256V2

Part # Distributor Description Stock Price Buy
DISTI # BGM123N256V2-ND
DigiKey RF TXRX MODULE BT CHIP SMD Min Qty: 1 Lead time: 12 Weeks Container: Tray Temporarily Out of Stock
  • 1 $10.5200
  • 10 $9.6430
  • 25 $8.7668
  • 80 $7.8901
  • 260 $7.2326
  • 520 $6.5751
  • 1,040 $5.9176
$5.9176 / $10.5200 Buy Now
DISTI # 634-BGM123N256V2
Mouser Electronics Bluetooth Modules - 802.15.1 BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin RoHS: Compliant 0
  • 1 $10.5200
  • 10 $7.9000
  • 250 $7.2400
  • 500 $6.5800
  • 1,000 $5.8300
$5.8300 / $10.5200 Order Now
Bristol Electronics   160
RFQ
Quest Components   128
  • 1 $13.9920
  • 28 $8.6284
  • 117 $7.6956
$7.6956 / $13.9920 Buy Now
Symmetry Electronics BGM123 Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, RF Pin Min Qty: 1 0
  • 1 $5.8200
$5.8200 Buy Now

Part Details for BGM123N256V2

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BGM123N256V2 Part Data Attributes

BGM123N256V2 Silicon Laboratories Inc
Buy Now Datasheet
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BGM123N256V2 Silicon Laboratories Inc Telecom Circuit, 1-Func, BGM-123, 56 PIN
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SILICON LABORATORIES INC
Package Description BGM-123, 56 PIN
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Date Of Intro 2016-11-02
Samacsys Manufacturer Silicon Labs
JESD-30 Code S-XXMA-N56
Length 6.5 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 56
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Shape SQUARE
Package Style MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.4 mm
Supply Voltage-Nom 3.3 V
Surface Mount YES
Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Position UNSPECIFIED
Time@Peak Reflow Temperature-Max (s) 40
Width 6.5 mm

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