Part Details for CL10B224KO8NNND by Samsung Electro-Mechanics
Overview of CL10B224KO8NNND by Samsung Electro-Mechanics
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CL10B224KO8NNND
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CL10B224KO8NNND-ND
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DigiKey | CAP CER 0.22UF 16V X7R 0603 Lead time: 22 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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Buy Now | |
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Future Electronics | CL10 Series 0.22 uF 16 V ±10% Tolerance X7R SMT Multilayer Ceramic Capacitor RoHS: Compliant pbFree: Yes Min Qty: 100000 Package Multiple: 10000 Container: Reel | 0Reel |
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$0.0024 / $0.0029 | Buy Now |
Part Details for CL10B224KO8NNND
CL10B224KO8NNND CAD Models
CL10B224KO8NNND Part Data Attributes:
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CL10B224KO8NNND
Samsung Electro-Mechanics
Buy Now
Datasheet
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Compare Parts:
CL10B224KO8NNND
Samsung Electro-Mechanics
Capacitor, Ceramic, Chip, General Purpose, 0.22uF, 16V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SAMSUNG ELECTRO-MECHANICS | |
| Part Package Code | 0603 | |
| Package Description | CHIP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8532.24.00.20 | |
| Capacitance | 0.22 µF | |
| Capacitor Type | CERAMIC CAPACITOR | |
| Dielectric Material | CERAMIC | |
| Height | 0.8 mm | |
| JESD-609 Code | e3 | |
| Length | 1.6 mm | |
| Mounting Feature | SURFACE MOUNT | |
| Multilayer | Yes | |
| Negative Tolerance | 10% | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Shape | RECTANGULAR PACKAGE | |
| Package Style | SMT | |
| Packing Method | TR, CARDBOARD PAPER, 13 INCH | |
| Positive Tolerance | 10% | |
| Rated (DC) Voltage (URdc) | 16 V | |
| Size Code | 0603 | |
| Surface Mount | YES | |
| Temperature Characteristics Code | X7R | |
| Temperature Coefficient | 15% ppm/°C | |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier | |
| Terminal Shape | WRAPAROUND | |
| Width | 0.8 mm |
Alternate Parts for CL10B224KO8NNND
This table gives cross-reference parts and alternative options found for CL10B224KO8NNND. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CL10B224KO8NNND, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 0603B224K160CR | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | Walsin Technology Corporation | CL10B224KO8NNND vs 0603B224K160CR |
| 0603B224K160NT | Ceramic Capacitor, Ceramic, 16V, X7R, -/+15ppm/Cel TC, 0.22uF, 0603 | Hitano Enterprise Corp | CL10B224KO8NNND vs 0603B224K160NT |
| EMK107B7224KA | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | TAIYO YUDEN | CL10B224KO8NNND vs EMK107B7224KA |
| 0603B224K160ST | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | CL10B224KO8NNND vs 0603B224K160ST |
| 0603B224K160NT | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | CL10B224KO8NNND vs 0603B224K160NT |
| 0603B224K160C | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | CL10B224KO8NNND vs 0603B224K160C |
| 0603B224K160CB | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | CL10B224KO8NNND vs 0603B224K160CB |
| 0603B224K160SB | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | CL10B224KO8NNND vs 0603B224K160SB |
| MAASE168SB7224KTNA01 | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | TAIYO YUDEN | CL10B224KO8NNND vs MAASE168SB7224KTNA01 |
| 0603B224K160NB | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | CL10B224KO8NNND vs 0603B224K160NB |