Datasheets
CY7C1472BV25-200AXC by:

ZBT SRAM, 4MX18, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100

Part Details for CY7C1472BV25-200AXC by Cypress Semiconductor

Overview of CY7C1472BV25-200AXC by Cypress Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for CY7C1472BV25-200AXC

Part # Distributor Description Stock Price Buy
DISTI # 61M0536
Newark Sync Srams/Tray |Cypress Infineon Technologies CY7C1472BV25-200AXC Min Qty: 360 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
Rochester Electronics CY7C1472BV25 - ZBT SRAM, 4MX18, 3ns PQFP100 RoHS: Compliant Status: Active Min Qty: 1 114
  • 1 $143.7300
  • 25 $140.8600
  • 100 $135.1100
  • 500 $129.3600
  • 1,000 $122.1700
$122.1700 / $143.7300 Buy Now
Chip1Cloud 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL? Architecture 1660
RFQ
Flip Electronics Stock, ship today 570
  • 1 $94.6100
$94.6100 RFQ
Perfect Parts Corporation   103
RFQ

Part Details for CY7C1472BV25-200AXC

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CY7C1472BV25-200AXC Part Data Attributes

CY7C1472BV25-200AXC Cypress Semiconductor
Buy Now Datasheet
Compare Parts:
CY7C1472BV25-200AXC Cypress Semiconductor ZBT SRAM, 4MX18, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code QFP
Package Description 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Pin Count 100
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100
JESD-609 Code e3
Length 20 mm
Memory Density 75497472 bit
Memory IC Type ZBT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 100
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LQFP
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR
Package Style FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Standby Voltage-Min 2.38 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 14 mm

Alternate Parts for CY7C1472BV25-200AXC

This table gives cross-reference parts and alternative options found for CY7C1472BV25-200AXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1472BV25-200AXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1472BV25-200AXCT ZBT SRAM, 4MX18, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100 Infineon Technologies AG CY7C1472BV25-200AXC vs CY7C1472BV25-200AXCT
CY7C1472BV25-200AXC ZBT SRAM, 4MX18, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Infineon Technologies AG CY7C1472BV25-200AXC vs CY7C1472BV25-200AXC
Part Number Description Manufacturer Compare
CY7C1472V25-250BZI ZBT SRAM, 4MX18, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1472BV25-200AXC vs CY7C1472V25-250BZI
CY7C1482V25-250BZXC Cache SRAM, 4MX18, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 Cypress Semiconductor CY7C1472BV25-200AXC vs CY7C1482V25-250BZXC
GS8642V18E-300 Cache SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 GSI Technology CY7C1472BV25-200AXC vs GS8642V18E-300
GS864118E-300T Cache SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1472BV25-200AXC vs GS864118E-300T
GS8642ZV18GF-300I ZBT SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 1 MM PITCH, LEAD FREE, BGA-165 GSI Technology CY7C1472BV25-200AXC vs GS8642ZV18GF-300I
CY7C1473V33-133BZC ZBT SRAM, 4MX18, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1472BV25-200AXC vs CY7C1473V33-133BZC
CY7C1472BV33-200BZXI ZBT SRAM, 4MX18, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 Cypress Semiconductor CY7C1472BV25-200AXC vs CY7C1472BV33-200BZXI
CY7C1473V25-133BZI ZBT SRAM, 4MX18, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1472BV25-200AXC vs CY7C1473V25-133BZI
GS8642ZV18GF-300 ZBT SRAM, 4MX18, 5.5ns, CMOS, PBGA165, 1 MM PITCH, LEAD FREE, BGA-165 GSI Technology CY7C1472BV25-200AXC vs GS8642ZV18GF-300
CY7C1472V25-167BZC ZBT SRAM, 4MX18, 3.4ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1472BV25-200AXC vs CY7C1472V25-167BZC

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