Datasheets
CY7C4122KV13-106FCXC by:

QDR SRAM, 8MX18, CMOS, PBGA361, FCBGA-361

Part Details for CY7C4122KV13-106FCXC by Infineon Technologies AG

Overview of CY7C4122KV13-106FCXC by Infineon Technologies AG

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Price & Stock for CY7C4122KV13-106FCXC

Part # Distributor Description Stock Price Buy
DISTI # CY7C4122KV13-106FCXC-ND
DigiKey IC SRAM 144MBIT PAR 361FCBGA Min Qty: 600 Lead time: 11 Weeks Container: Tray Temporarily Out of Stock
  • 600 $263.5255
$263.5255 Buy Now
DISTI # CY7C4122KV13-106FC
Avnet Americas SRAM Chip Sync Single 1.3V 144M-Bit 8M x 18 361-Pin FCBGA - Trays (Alt: CY7C4122KV13-106FC) RoHS: Compliant Min Qty: 600 Package Multiple: 60 Lead time: 11 Weeks, 0 Days Container: Tray 0
  • 600 $317.2540
$317.2540 Buy Now
DISTI # 727-7C4122V13106FCXC
Mouser Electronics SRAM 144Mb, 1.3V, 106Mhz 8Mx18 QDR-IV HP SRAM RoHS: Compliant 0
  • 600 $263.2900
$263.2900 Order Now
DISTI # V79:2366_28731660
Arrow Electronics SRAM Chip Sync Single 1.3V 144M-bit 8M x 18 361-Pin FCBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2101 Americas - 1
  • 1 $258.0300
  • 600 $247.8100
$247.8100 / $258.0300 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 600 Package Multiple: 600 Lead time: 11 Weeks Container: Tray 0
Tray
  • 600 $255.8500
$255.8500 Buy Now
DISTI # 76443254
Verical SRAM Chip Sync Single 1.3V 144M-bit 8M x 18 361-Pin FCBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2101 Americas - 1
  • 1 $258.0300
  • 600 $247.8100
$247.8100 / $258.0300 Buy Now
DISTI # SP005652127
EBV Elektronik SRAM Chip Sync Single 1.3V 144M-Bit 8M x 18 361-Pin FCBGA (Alt: SP005652127) RoHS: Compliant Min Qty: 600 Package Multiple: 600 Lead time: 12 Weeks, 0 Days EBV - 0
Buy Now

Part Details for CY7C4122KV13-106FCXC

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CY7C4122KV13-106FCXC Part Data Attributes

CY7C4122KV13-106FCXC Infineon Technologies AG
Buy Now Datasheet
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CY7C4122KV13-106FCXC Infineon Technologies AG QDR SRAM, 8MX18, CMOS, PBGA361, FCBGA-361
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description FCBGA-361
Reach Compliance Code compliant
Factory Lead Time 11 Weeks
Samacsys Manufacturer Infineon
JESD-30 Code S-PBGA-B361
JESD-609 Code e1
Length 21 mm
Memory Density 150994944 bit
Memory IC Type QDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 361
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX18
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.765 mm
Supply Voltage-Max (Vsup) 1.34 V
Supply Voltage-Min (Vsup) 1.26 V
Supply Voltage-Nom (Vsup) 1.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 21 mm

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