Part Details for DA14531-00000OG2 by Dialog Semiconductor GmbH
Overview of DA14531-00000OG2 by Dialog Semiconductor GmbH
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Price & Stock for DA14531-00000OG2
| Part # | Distributor | Description | Stock | Price | Buy | |
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Future Electronics | 3.3 V 2.4 GHz 2.5 dBm Ultra Low Power Bluetooth 5.1 SoC - WLCSP-17 RoHS: Compliant pbFree: Yes Min Qty: 4000 Package Multiple: 4000 Container: Reel | 0Reel |
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$0.7600 | Buy Now |
Part Details for DA14531-00000OG2
DA14531-00000OG2 CAD Models
DA14531-00000OG2 Part Data Attributes
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DA14531-00000OG2
Dialog Semiconductor GmbH
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Datasheet
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DA14531-00000OG2
Dialog Semiconductor GmbH
Telecom Circuit,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | DIALOG SEMICONDUCTOR GMBH | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-11-02 | |
| Samacsys Manufacturer | Dialog Semiconductor | |
| Additional Feature | also available with 1000 and 100 packing quantity | |
| JESD-30 Code | R-PBGA-B17 | |
| Length | 2.032 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 17 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA17,5X7,23 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 0.375 mm | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.6 mm | |
| Terminal Position | BOTTOM | |
| Width | 1.694 mm |