Part Details for DGM28-B56D81BCBQC by Innodisk Corporation
Overview of DGM28-B56D81BCBQC by Innodisk Corporation
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Price & Stock for DGM28-B56D81BCBQC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Neutron USA | SSD, M.2 (S80) 3MG2-P w/15nm(Standard Grade, 0°C ~ +70°C) -- 256GB M.2 S80 3MG2-P MLC | 3 |
|
$627.5300 | Buy Now |
Part Details for DGM28-B56D81BCBQC
DGM28-B56D81BCBQC CAD Models
DGM28-B56D81BCBQC Part Data Attributes
|
|
DGM28-B56D81BCBQC
Innodisk Corporation
Buy Now
Datasheet
|
Compare Parts:
DGM28-B56D81BCBQC
Innodisk Corporation
Memory Circuit, 256GX8, CMOS, PACKAGE
|
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | INNODISK CORP | |
| Package Description | MODULE | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | WD-MAX | |
| JESD-30 Code | R-XSMA-N | |
| Length | 80 mm | |
| Memory Density | 2199023255552 bit | |
| Memory IC Type | FLASH MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Words | 274877906944 words | |
| Number of Words Code | 256000000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256GX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | SMA | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Parallel/Serial | SERIAL | |
| Seated Height-Max | 22.15 mm | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | SINGLE | |
| Type | MLC NAND TYPE | |
| Width | 2.58 mm |