Part Details for ECC608-TFLXWPCU by Microchip Technology Inc
Overview of ECC608-TFLXWPCU by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for ECC608-TFLXWPCU
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
150-ECC608-TFLXWPCUTR-ND
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DigiKey | IC TRANSMITTER 8UDFN Lead time: 7 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
ECC608-TFLXWPCU
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Microchip Technology Inc | Trust Flex WPC Provisioned 8-UDFN 2K MOQ, Projected EOL: 2049-03-24 RoHS: Compliant pbFree: Yes |
3600 Alternates Available |
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$0.9500 | Buy Now |
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Ameya Holding Limited | 23092 |
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RFQ |
Part Details for ECC608-TFLXWPCU
ECC608-TFLXWPCU CAD Models
ECC608-TFLXWPCU Part Data Attributes
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ECC608-TFLXWPCU
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
ECC608-TFLXWPCU
Microchip Technology Inc
CMOS, PDSO8
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-PDSO-N8 | |
| JESD-609 Code | e4 | |
| Length | 3 mm | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC8,.12,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Seated Height-Max | 0.6 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Gold (Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 2 mm | |
| uPs/uCs/Peripheral ICs Type | CRYPTOGRAPHIC AUTHENTICATOR |