Part Details for EDW2032BBBG-50-F by Elpida Memory Inc
Overview of EDW2032BBBG-50-F by Elpida Memory Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Telecommunications
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Computing and Data Storage
Aerospace and Defense
Healthcare
Robotics and Drones
Price & Stock for EDW2032BBBG-50-F
Part # | Distributor | Description | Stock | Price | Buy | |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 50 |
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Part Details for EDW2032BBBG-50-F
EDW2032BBBG-50-F CAD Models
EDW2032BBBG-50-F Part Data Attributes:
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EDW2032BBBG-50-F
Elpida Memory Inc
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Datasheet
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EDW2032BBBG-50-F
Elpida Memory Inc
DDR DRAM, 64MX32, CMOS, PBGA170, HALOGEN FREE AND ROHS COMPLIANT, FBGA-170
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ELPIDA MEMORY INC | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 170 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH; ALSO OPERATES AT 1.35 V | |
I/O Type | COMMON | |
Interleaved Burst Length | 8 | |
JESD-30 Code | R-PBGA-B170 | |
JESD-609 Code | e1 | |
Length | 14 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR5 DRAM | |
Memory Width | 32 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 170 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 64MX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA170,14X17,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 8 | |
Supply Voltage-Max (Vsup) | 1.545 V | |
Supply Voltage-Min (Vsup) | 1.455 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 12 mm |