Part Details for EFM32WG990F128-B-BGA112 by Silicon Laboratories Inc
Overview of EFM32WG990F128-B-BGA112 by Silicon Laboratories Inc
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Consumer Electronics
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Price & Stock for EFM32WG990F128-B-BGA112
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
336-EFM32WG990F128-B-BGA112-ND
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DigiKey | IC MCU 32BIT 128KB FLASH 112BGA Min Qty: 840 Lead time: 12 Weeks Container: Tray | Limited Supply - Call |
|
$8.3037 | Buy Now |
|
DISTI #
634-WG990F128BBGA112
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Mouser Electronics | ARM Microcontrollers - MCU Wonder Gecko MCU IC 128KB RoHS: Compliant | 0 |
|
Order Now | |
|
|
Symmetry Electronics | Min Qty: 1 | 0 |
|
$7.6400 | Buy Now |
Part Details for EFM32WG990F128-B-BGA112
EFM32WG990F128-B-BGA112 CAD Models
EFM32WG990F128-B-BGA112 Part Data Attributes
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EFM32WG990F128-B-BGA112
Silicon Laboratories Inc
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Datasheet
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EFM32WG990F128-B-BGA112
Silicon Laboratories Inc
Microcontroller,
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SILICON LABORATORIES INC | |
| Package Description | LFBGA, BGA112,11X11,32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Date Of Intro | 2019-11-15 | |
| Samacsys Manufacturer | Silicon Labs | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| CPU Family | CORTEX-M4 | |
| Clock Frequency-Max | 48 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| Format | FLOATING POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | S-PBGA-B112 | |
| JESD-609 Code | e4 | |
| Length | 10 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 12 | |
| Number of External Interrupts | 16 | |
| Number of I/O Lines | 86 | |
| Number of Serial I/Os | 7 | |
| Number of Terminals | 112 | |
| Number of Timers | 5 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA112,11X11,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 32768 | |
| RAM (words) | 8192 | |
| ROM (words) | 131072 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.3 mm | |
| Speed | 48 MHz | |
| Supply Voltage-Max | 3.8 V | |
| Supply Voltage-Min | 1.98 V | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | NICKEL GOLD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |