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Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
544-1389-ND
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DigiKey | IC CPLD 1700MC 7NS 256FBGA Min Qty: 90 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$137.0108 | Buy Now |
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EPM2210GF256C3N
Intel Corporation
Buy Now
Datasheet
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Compare Parts:
EPM2210GF256C3N
Intel Corporation
Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
JTAG BST | YES | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | ||
Number of I/O Lines | 204 | |
Number of Inputs | 204 | |
Number of Macro Cells | 1700 | |
Number of Outputs | 204 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 0 DEDICATED INPUTS, 204 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FLASH PLD | |
Propagation Delay | 7 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.2 mm | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
This table gives cross-reference parts and alternative options found for EPM2210GF256C3N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPM2210GF256C3N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
EPM2210GF256I3N | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | Altera Corporation | EPM2210GF256C3N vs EPM2210GF256I3N |
EPM2210GF256A3N | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | Altera Corporation | EPM2210GF256C3N vs EPM2210GF256A3N |
EPM2210GF256A3N | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | Intel Corporation | EPM2210GF256C3N vs EPM2210GF256A3N |
EPM2210GF256C3 | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 | Altera Corporation | EPM2210GF256C3N vs EPM2210GF256C3 |
EPM2210GF256I3N | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | Intel Corporation | EPM2210GF256C3N vs EPM2210GF256I3N |
EPM2210GF256C3N | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | Altera Corporation | EPM2210GF256C3N vs EPM2210GF256C3N |