Datasheets
GS8162Z18DB-400 by: GSI Technology

ZBT SRAM, 1MX18, 4ns, CMOS, PBGA119, FPBGA-119

Part Details for GS8162Z18DB-400 by GSI Technology

Overview of GS8162Z18DB-400 by GSI Technology

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Price & Stock for GS8162Z18DB-400

Part # Distributor Description Stock Price Buy
DISTI # GS8162Z18DB-400
Avnet Americas SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 4ns/2.5ns 119-Pin F-BGA - Bulk (Alt: GS8162Z18DB-400) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 84 $37.1250
  • 168 $36.4500
  • 336 $34.6500
  • 504 $33.7500
  • 672 $32.6250
  • 840 $31.0500
  • 8,400 $30.1500
$30.1500 / $37.1250 Buy Now
DISTI # 464-GS8162Z18DB-400
Mouser Electronics SRAM 2.5 or 3.3V 1M x 18 18M RoHS: Not Compliant 0
  • 1 $39.7900
  • 10 $36.9100
  • 21 $35.5800
  • 42 $34.7000
  • 105 $30.4000
  • 252 $29.5600
$29.5600 / $39.7900 Order Now
DISTI # GS8162Z18DB-400
Avnet Americas SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 4ns/2.5ns 119-Pin F-BGA - Bulk (Alt: GS8162Z18DB-400) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 84 $37.1250
  • 168 $36.4500
  • 336 $34.6500
  • 504 $33.7500
  • 672 $32.6250
  • 840 $31.0500
  • 8,400 $30.1500
$30.1500 / $37.1250 Buy Now

Part Details for GS8162Z18DB-400

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GS8162Z18DB-400 Part Data Attributes:

GS8162Z18DB-400 GSI Technology
Buy Now Datasheet
Compare Parts:
GS8162Z18DB-400 GSI Technology ZBT SRAM, 1MX18, 4ns, CMOS, PBGA119, FPBGA-119
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description BGA,
Pin Count 119
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 4 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 Code R-PBGA-B119
Length 22 mm
Memory Density 18874368 bit
Memory IC Type ZBT SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 119
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1MX18
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.99 mm
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

Alternate Parts for GS8162Z18DB-400

This table gives cross-reference parts and alternative options found for GS8162Z18DB-400. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8162Z18DB-400, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8162Z18DB-400I ZBT SRAM, 1MX18, 4ns, CMOS, PBGA119, FPBGA-119 GSI Technology GS8162Z18DB-400 vs GS8162Z18DB-400I
Part Number Description Manufacturer Compare
GS8162Z18DB-400I ZBT SRAM, 1MX18, 4ns, CMOS, PBGA119, FPBGA-119 GSI Technology GS8162Z18DB-400 vs GS8162Z18DB-400I

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