Datasheets
GS8672D38BE-550 by: GSI Technology

QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Part Details for GS8672D38BE-550 by GSI Technology

Overview of GS8672D38BE-550 by GSI Technology

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Price & Stock for GS8672D38BE-550

Part # Distributor Description Stock Price Buy
DISTI # GS8672D38BE-550
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672D38BE-550) RoHS: Not Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 464-GS8672D38BE-550
Mouser Electronics SRAM RoHS: Not Compliant 0
  • 1 $172.8600
  • 10 $150.6100
  • 30 $150.1900
$150.1900 / $172.8600 Order Now
DISTI # GS8672D38BE-550
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672D38BE-550) RoHS: Not Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk 0
RFQ

Part Details for GS8672D38BE-550

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GS8672D38BE-550 Part Data Attributes:

GS8672D38BE-550 GSI Technology
Buy Now Datasheet
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GS8672D38BE-550 GSI Technology QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 12 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINE ARCHITECTURE
Clock Frequency-Max (fCLK) 550 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 2.44 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for GS8672D38BE-550

This table gives cross-reference parts and alternative options found for GS8672D38BE-550. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8672D38BE-550, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8672D38BE-550T QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS8672D38BE-550T
GS8672D38BGE-550T Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS8672D38BGE-550T
Part Number Description Manufacturer Compare
CY7C1515AV18-300BZXC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8672D38BE-550 vs CY7C1515AV18-300BZXC
IS61QDPB42M36-375M3 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 11 X 15 MM, BGA-165 Integrated Silicon Solution Inc GS8672D38BE-550 vs IS61QDPB42M36-375M3
GS8662T38AGE-375T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS8662T38AGE-375T
GS81302T37E-450 DDR SRAM, 2MX36, 0.37ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS81302T37E-450
GS8662R36BGD-167T Standard SRAM, 2MX36, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS8662R36BGD-167T
GS8672D37BE-300I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS8672D37BE-300I
GS8662T36E-167IT DDR SRAM, 2MX36, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1MM PITCH, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS8662T36E-167IT
GS8672Q37AE-400IT Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D38BE-550 vs GS8672Q37AE-400IT
GS8672T36BE-250I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 GSI Technology GS8672D38BE-550 vs GS8672T36BE-250I
CY7C1514JV18-250BZC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8672D38BE-550 vs CY7C1514JV18-250BZC

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