Datasheets
GS8672Q19BGE-333I by: GSI Technology

QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8672Q19BGE-333I by GSI Technology

Overview of GS8672Q19BGE-333I by GSI Technology

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Applications Industrial Automation Energy and Power Systems Renewable Energy

Price & Stock for GS8672Q19BGE-333I

Part # Distributor Description Stock Price Buy
DISTI # GS8672Q19BGE-333I
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672Q19BGE-333I) RoHS: Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 464-GS8672Q19BGE333I
Mouser Electronics SRAM RoHS: Compliant 0
  • 1 $129.7100
  • 10 $116.7800
  • 30 $114.2100
  • 60 $111.8100
$111.8100 / $129.7100 Order Now
DISTI # GS8672Q19BGE-333I
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672Q19BGE-333I) RoHS: Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk 0
RFQ

Part Details for GS8672Q19BGE-333I

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GS8672Q19BGE-333I Part Data Attributes:

GS8672Q19BGE-333I GSI Technology
Buy Now Datasheet
Compare Parts:
GS8672Q19BGE-333I GSI Technology QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 12 Weeks
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 165
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 1.21 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm

Alternate Parts for GS8672Q19BGE-333I

This table gives cross-reference parts and alternative options found for GS8672Q19BGE-333I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8672Q19BGE-333I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8672Q19BE-333IT QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672Q19BGE-333I vs GS8672Q19BE-333IT
GS8672Q19BGE-333IT QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672Q19BGE-333I vs GS8672Q19BGE-333IT
Part Number Description Manufacturer Compare
GS8672Q19BGE-333IT QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672Q19BGE-333I vs GS8672Q19BGE-333IT
GS8672Q19BE-333IT QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672Q19BGE-333I vs GS8672Q19BE-333IT

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