Part Details for H26M41208HPR by SK Hynix Inc
Overview of H26M41208HPR by SK Hynix Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for H26M41208HPR
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
SMC-H26M41208HPR
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Sensible Micro Corporation | OEM Excess 5-7 Days Leadtime, We are an AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days Date Code: 2101 | 5038 |
|
RFQ | |
DISTI #
SMC-H26M41208HPR
|
Sensible Micro Corporation | OEM Excess 5-7 Days Leadtime, We are an AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 31508 |
|
RFQ | |
DISTI #
SMC-H26M41208HPR
|
Sensible Micro Corporation | Ic-Mem, Flashmod, Klm8G1Getf-B041003, 8Gb, Emmc5.1, Fbga, 153 RoHS: Compliant Min Qty: 25 Lead time: 0 Weeks, 1 Days Date Code: 2109 Container: Trays | 4800 |
|
$2.6000 / $3.0875 | RFQ |
|
CHIPMALL.COM LIMITED | - NAND FLASH ROHS | 368 |
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$3.6228 / $5.0423 | Buy Now |
|
LCSC | FBGA-153(11.5x13) eMMC ROHS | 368 |
|
$3.6967 / $5.1452 | Buy Now |
Part Details for H26M41208HPR
H26M41208HPR CAD Models
H26M41208HPR Part Data Attributes:
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H26M41208HPR
SK Hynix Inc
Buy Now
Datasheet
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Compare Parts:
H26M41208HPR
SK Hynix Inc
Flash, 8GX8, PBGA153, FBGA-153
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | SK HYNIX INC | |
Package Description | FBGA-153 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
JESD-30 Code | R-PBGA-B153 | |
Length | 13 mm | |
Memory Density | 68719476736 bit | |
Memory IC Type | FLASH CARD | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 8589934592 words | |
Number of Words Code | 8000000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 8GX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA153,14X14,20 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 3.3 V | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 11.5 mm |