Datasheets
HN27C101AP-15 by:

OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Part Details for HN27C101AP-15 by Hitachi Ltd

Overview of HN27C101AP-15 by Hitachi Ltd

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Price & Stock for HN27C101AP-15

Part # Distributor Description Stock Price Buy
Bristol Electronics   30
RFQ

Part Details for HN27C101AP-15

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HN27C101AP-15 Part Data Attributes:

HN27C101AP-15 Hitachi Ltd
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HN27C101AP-15 Hitachi Ltd OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer HITACHI LTD
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 150 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Length 41.9 mm
Memory Density 1048576 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN27C101AP-15

This table gives cross-reference parts and alternative options found for HN27C101AP-15. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C101AP-15, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TC541001AP-15 IC 128K X 8 OTPROM, 150 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM Toshiba America Electronic Components HN27C101AP-15 vs TC541001AP-15
HN27C301AP-15 128KX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Renesas Electronics Corporation HN27C101AP-15 vs HN27C301AP-15
MSM271000ZBRS OTP ROM, 128KX8, 150ns, NMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd HN27C101AP-15 vs MSM271000ZBRS
AT27LV010-15PI OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN27C101AP-15 vs AT27LV010-15PI
IS27C010-15WI OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Integrated Silicon Solution Inc HN27C101AP-15 vs IS27C010-15WI
AT27LV010-15PC OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN27C101AP-15 vs AT27LV010-15PC
HN27C101AP-15 128KX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Renesas Electronics Corporation HN27C101AP-15 vs HN27C101AP-15
HN27C301AP-15 OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd HN27C101AP-15 vs HN27C301AP-15
27C010-15N OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 YAGEO Corporation HN27C101AP-15 vs 27C010-15N
AT27C010-15PA OTP ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN27C101AP-15 vs AT27C010-15PA
Part Number Description Manufacturer Compare
AM29F010B-120PE Flash, 128KX8, 120ns, PDIP32, PLASTIC, DIP-32 AMD HN27C101AP-15 vs AM29F010B-120PE
CAT28F010V5P-12 Flash, 128KX8, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101AP-15 vs CAT28F010V5P-12
WMF128K8-150CM5 Flash, 128KX8, 150ns, CDIP32, 0.600 INCH, SINGLE- CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN27C101AP-15 vs WMF128K8-150CM5
WE128K8150CI EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN27C101AP-15 vs WE128K8150CI
28C010TRT4DS-20 EEPROM, 128KX8, 200ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN27C101AP-15 vs 28C010TRT4DS-20
CAT28F001L-90B Flash, 128KX8, 90ns, PDIP32, LEAD AND HALOGEN FREE, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101AP-15 vs CAT28F001L-90B
HN62331AP-12 128KX8 MASK PROM, 120ns, PDIP32, PLASTIC, DIP-32 Renesas Electronics Corporation HN27C101AP-15 vs HN62331AP-12
CAT28F010PI-12 Flash, 128KX8, 120ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101AP-15 vs CAT28F010PI-12
WME128K8-250CMEA EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN27C101AP-15 vs WME128K8-250CMEA
5962-9679605HYA EEPROM, 128KX8, 140ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 Microsemi Corporation HN27C101AP-15 vs 5962-9679605HYA

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