Part Details for IS43LD32640C-18BLI by Integrated Silicon Solution Inc
Overview of IS43LD32640C-18BLI by Integrated Silicon Solution Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for IS43LD32640C-18BLI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
47AK0394
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Newark | 2G, 1.2/1.8V, Lpddr2, 64Mx32, 533Mhz, 134 Ball Bga (10Mm X 11.5Mm) Rohs, It |Integrated Silicon Solution (Issi) IS43LD32640C-18BLI Min Qty: 171 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$8.7900 / $10.4000 | Buy Now |
|
DISTI #
706-IS43LD32640C-18BLI-ND
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DigiKey | IC DRAM 2GBIT PARALLEL 134TFBGA Min Qty: 1 Lead time: 10 Weeks Container: Tray |
166 In Stock |
|
$7.0988 / $9.8500 | Buy Now |
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DISTI #
IS43LD32640C-18BLI
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Avnet Americas | DRAM Chip Mobile LPDDR2-S4 SDRAM 2Gbit 64M X 32 1.2V/1.8V 134-Pin TFBGA - Trays (Alt: IS43LD32640C-18BLI) Min Qty: 171 Package Multiple: 171 Container: Tray | 0 |
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$8.0750 / $9.8838 | Buy Now |
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DISTI #
IS43LD32640C-18BLI
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Avnet Americas | 2G, 1.2/1.8V, LPDDR2, 64MX32, 533MHZ, 134 BALL BGA (10MMX11.5MM) ROHS, IT, T&R - Tape and Reel (Alt: IS43LD32640C-18BLI) Min Qty: 2000 Package Multiple: 2000 Container: Reel | 0 |
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$8.1375 / $9.9603 | Buy Now |
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DISTI #
870-S43LD32640C18BLI
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Mouser Electronics | DRAM 2G, 1.2/1.8V, LPDDR2, 64Mx32, 533MHz, 134 ball BGA (10mmx11.5mm) RoHS, IT RoHS: Compliant | 0 |
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$7.0900 / $7.4100 | Order Now |
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DISTI #
IS43LD32640C-18BLI
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Avnet Silica | DRAM Chip Mobile LPDDR2-S4 SDRAM 2Gbit 64M X 32 1.2V/1.8V 134-Pin TFBGA (Alt: IS43LD32640C-18BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 28 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS43LD32640C-18BLI
IS43LD32640C-18BLI CAD Models
IS43LD32640C-18BLI Part Data Attributes:
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IS43LD32640C-18BLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS43LD32640C-18BLI
Integrated Silicon Solution Inc
DRAM,
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | 2020-03-26 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | also operates with 1.8v nom supply | |
| Clock Frequency-Max (fCLK) | 533 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8,16 | |
| JESD-30 Code | R-PBGA-B134 | |
| Length | 11.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | LPDDR2 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 134 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA134,10X17,25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.1 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8,16 | |
| Standby Current-Max | 0.01 A | |
| Supply Current-Max | 0.21 mA | |
| Supply Voltage-Max (Vsup) | 1.3 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |