Part Details for IS43LQ32256EA-062BLI by Integrated Silicon Solution Inc
Overview of IS43LQ32256EA-062BLI by Integrated Silicon Solution Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for IS43LQ32256EA-062BLI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS43LQ32256EA-062BLI
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Avnet Silica | DRAM Chip DDR4 SDRAM 8G-bit 1600MHz 200-Pin FBGA (Alt: IS43LQ32256EA-062BLI) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Part Details for IS43LQ32256EA-062BLI
IS43LQ32256EA-062BLI CAD Models
IS43LQ32256EA-062BLI Part Data Attributes:
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IS43LQ32256EA-062BLI
Integrated Silicon Solution Inc
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Datasheet
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IS43LQ32256EA-062BLI
Integrated Silicon Solution Inc
DDR DRAM, 256MX32, CMOS, PBGA200, BGA-200
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, BGA200,12X22,32/25 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | TERM PITCH-MAX | |
| Clock Frequency-Max (fCLK) | 1600 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| JESD-609 Code | e1 | |
| Length | 14.5 mm | |
| Memory Density | 8589934592 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA200,12X22,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.1 mm | |
| Self Refresh | NO | |
| Sequential Burst Length | 16,32 | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |