Part Details for LC4256V-75F256AC by Lattice Semiconductor Corporation
Overview of LC4256V-75F256AC by Lattice Semiconductor Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for LC4256V-75F256AC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-LC4256V-75F256AC-ND
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DigiKey | IC CPLD 256MC 7.5NS 256FPBGA Min Qty: 16 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
16 In Stock |
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$22.7400 | Buy Now |
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Bristol Electronics | Min Qty: 1 | 12 |
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$24.0000 | Buy Now |
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Quest Components | COMPLEX-EEPLD, 256-CELL, 8NS PROP DELAY, 256 Pin, Plastic, BGA | 9 |
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$26.0000 | Buy Now |
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Rochester Electronics | EE PLD, 7.5ns, 256-Cell PBGA256 RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 16 |
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$19.5200 / $22.9700 | Buy Now |
Part Details for LC4256V-75F256AC
LC4256V-75F256AC CAD Models
LC4256V-75F256AC Part Data Attributes:
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LC4256V-75F256AC
Lattice Semiconductor Corporation
Buy Now
Datasheet
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LC4256V-75F256AC
Lattice Semiconductor Corporation
EE PLD, 7.5ns, 256-Cell, CMOS, PBGA256, FPBGA-256
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | FPBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Architecture | PAD-TYPE | |
Clock Frequency-Max | 111 MHz | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
JTAG BST | YES | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 128 | |
Number of Inputs | 132 | |
Number of Macro Cells | 256 | |
Number of Outputs | 128 | |
Number of Product Terms | 83 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 90 °C | |
Operating Temperature-Min | ||
Organization | 4 DEDICATED INPUTS, 128 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 225 | |
Programmable Logic Type | EE PLD | |
Propagation Delay | 7.5 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.1 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |