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Field Programmable Gate Array,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
220-1979-ND
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DigiKey | IC FPGA 245 I/O 554CABGA Min Qty: 60 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$66.4500 | Buy Now |
DISTI #
842-LFE5UM45F8BG554I
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Mouser Electronics | FPGA - Field Programmable Gate Array ECP5 FPGA 45K LUTs w/ SERDES RoHS: Compliant | 0 |
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$63.9600 / $66.4500 | Order Now |
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Future Electronics | ECP5 Series 44 K LUTs 245 I/O 1.155 V SMT FPGA Configuration - CABGA-554 RoHS: Compliant pbFree: Yes Min Qty: 60 Package Multiple: 60 Container: Tray | 0Tray |
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$65.1500 | Buy Now |
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Flip Electronics | Stock | 2000 |
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RFQ |
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LFE5UM-45F-8BG554I
Lattice Semiconductor Corporation
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Datasheet
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LFE5UM-45F-8BG554I
Lattice Semiconductor Corporation
Field Programmable Gate Array,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
Package Description | CABGA-554 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Lattice Semiconductor | |
JESD-30 Code | S-PBGA-B554 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 5500 | |
Number of Inputs | 245 | |
Number of Logic Cells | 44000 | |
Number of Outputs | 245 | |
Number of Terminals | 554 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 5500 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA554,26X26,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 1.76 mm | |
Supply Voltage-Max | 1.155 V | |
Supply Voltage-Min | 1.045 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm |