Part Details for LPC1112FHI33/203,5 by NXP Semiconductors
Overview of LPC1112FHI33/203,5 by NXP Semiconductors
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for LPC1112FHI33/203,5
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
74T4537
|
Newark | Scalable Entry Level 32-Bit Microcontroller (Mcu) Based On Arm Cortex-M0+/M0 Cores/ Tray Rohs Compliant: Yes |Nxp LPC1112FHI33/203,5 Min Qty: 490 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$1.6400 / $1.6900 | Buy Now |
DISTI #
568-8566-ND
|
DigiKey | IC MCU 32BIT 16KB FLASH 32HVQFN Min Qty: 1 Lead time: 13 Weeks Container: Tray |
215 In Stock |
|
$1.8244 / $3.7800 | Buy Now |
DISTI #
LPC1112FHI33/203,5
|
Avnet Americas | MCU 32-bit LPC1100 ARM Cortex M0 RISC 16KB Flash 3.3V 32-Pin HVQFN EP Tray - Trays (Alt: LPC1112FHI33/203,5) RoHS: Compliant Min Qty: 490 Package Multiple: 490 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$1.5216 / $1.7548 | Buy Now |
DISTI #
771-LPC1112FHI332035
|
Mouser Electronics | ARM Microcontrollers - MCU Cortex-M0 16kB flash up to 4 kB SRAM RoHS: Compliant | 439 |
|
$1.8000 / $3.7800 | Buy Now |
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 490 Package Multiple: 490 Container: Tray | 0Tray |
|
$1.5400 | Buy Now |
DISTI #
LPC1112FHI33/203,5
|
Avnet Silica | MCU 32-bit LPC1100 ARM Cortex M0 RISC 16KB Flash 3.3V 32-Pin HVQFN EP Tray (Alt: LPC1112FHI33/203,5) RoHS: Compliant Min Qty: 490 Package Multiple: 490 Lead time: 15 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
DISTI #
LPC1112FHI33/203,5
|
EBV Elektronik | MCU 32-bit LPC1100 ARM Cortex M0 RISC 16KB Flash 3.3V 32-Pin HVQFN EP Tray (Alt: LPC1112FHI33/203,5) RoHS: Compliant Min Qty: 490 Package Multiple: 490 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now | |
|
Flip Electronics | Stock | 4400 |
|
RFQ |
Part Details for LPC1112FHI33/203,5
LPC1112FHI33/203,5 CAD Models
LPC1112FHI33/203,5 Part Data Attributes:
|
LPC1112FHI33/203,5
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
LPC1112FHI33/203,5
NXP Semiconductors
LPC1112FHI33 - 16kB flash, 4kB SRAM, HVQFN32 package QFN 32-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Pin Count | 32 | |
Manufacturer Package Code | SOT617-3 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M0 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQCC-N32 | |
JESD-609 Code | e4 | |
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 28 | |
Number of Terminals | 33 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC32,.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 4096 | |
ROM (words) | 16384 | |
ROM Programmability | FLASH | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |