Part Details for LPC1114FHN33/303Y by NXP Semiconductors
Overview of LPC1114FHN33/303Y by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for LPC1114FHN33/303Y
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC1114FHN33/303Y-ND
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DigiKey | IC MCU 32BIT 32KB FLASH 32HVQFN Min Qty: 4000 Lead time: 13 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$2.2571 | Buy Now |
DISTI #
LPC1114FHN33/303Y
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Avnet Americas | MCU 32-Bit LPC1114 ARM Cortex M0 RISC 32KB Flash 2.5V/3.3V 33-Pin HVQFN T/R - Tape and Reel (Alt: LPC1114FHN33/303Y) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
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$1.8264 / $2.0163 | Buy Now |
DISTI #
771-LPC1114FHN33303Y
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Mouser Electronics | ARM Microcontrollers - MCU 32kB flash, 8kB SRAM, HVQFN32 package RoHS: Compliant | 0 |
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$2.1700 | Order Now |
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Future Electronics | 32-bit MCU 32kB flash, 8kB SRAM, HVQFN32 package RoHS: Compliant pbFree: Yes Min Qty: 4000 Package Multiple: 4000 Lead time: 13 Weeks Container: Reel | 0Reel |
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$1.9800 | Buy Now |
DISTI #
LPC1114FHN33/303Y
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EBV Elektronik | (Alt: LPC1114FHN33/303Y) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for LPC1114FHN33/303Y
LPC1114FHN33/303Y CAD Models
LPC1114FHN33/303Y Part Data Attributes:
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LPC1114FHN33/303Y
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1114FHN33/303Y
NXP Semiconductors
LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQCCN, | |
Pin Count | 32 | |
Manufacturer Package Code | SOT865-3 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M0 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 28 | |
Number of Terminals | 33 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 8192 | |
ROM (words) | 32768 | |
ROM Programmability | FLASH | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Alternate Parts for LPC1114FHN33/303Y
This table gives cross-reference parts and alternative options found for LPC1114FHN33/303Y. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC1114FHN33/303Y, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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LPC1114FHN33/303,5 | LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin | NXP Semiconductors | LPC1114FHN33/303Y vs LPC1114FHN33/303,5 |